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HY560 is a hardening compound that creates a cold-curing epoxy system when combined with specific resins. The product has multiple cold-cure applications, particularly in processing functions like pressure molding, resin transfer molding and wet lay-up. When mixing HY560 with resin, mechanics should create multiple small batches rather than one large batch. Processing large quantities will cause decreased pot life due to exothermic reactions. Cure times will vary depending on temperature.